Device picking wafer sheets

This device automatically detects if each wafer sheet which comes through is baked correctly. In case if a damaged wafer occurs – such wafer is automatically removed by the device.

• Material: stainless steel
• Motor: SEW (Germany)
• Dimensions: ( L. x W. x H.)  2200 mm x 1060 mm x 840mm
• Power supply: 0,18 kW