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Sizing mill

This is the machine mating closely with the spreader. Its task is to obtain the uniform thickness of the whole packet of spreaded wafer sheets. Thickness of the packet is the especially important parameter during further processing - by cutting and sorting of wafers. Sizing of wafer packet thickness has the direct influence on appearance and shape of wafers designed for consumption. Sizing mill device is run by one person. It has fluent control of belt transport and of wafer packet thickness. The machine has high productivity, is durable, easy and safe for operating.

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Firma Kocuła
ul. Wiśniowa 5
Mokronos Dolny
55-080 Kąty Wrocławskie

tel.: +48  71 363 50 15



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