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Cut-out devices (punches)

In order to obtain a wafer ball, it is necessary to spread cream on 2 wafer sheets (from cavities side) and put them (stick together) with their spreaded surfaces together in such a manner that we can get the ball section. Then we should lay these two, bound together, wafer sheets on the cut-out device (punch) and to cut balls which, falling down, will be separated from wafer wastes. The cut out device is a separate mechanical installation, having strictly defined division of cutting-out knives, enabling separation of all balls from the flat wafer waste by one motion (cut).

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Firma Kocuła
ul. Wiśniowa 5
Mokronos Dolny
55-080 Kąty Wrocławskie

tel.: +48  71 363 50 15



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