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Wafer cutting device

Cutting wafer sheets according to the size demanded by the client. The cutting unit can be wire or a knife.

  • Material: frame made out of stainless steel
  • Cover: made out of stainless steel X5CrNi18-10
  • Motor: SEW (Germany)
  • Programming: Simens (Germany)
  • Switch: Schneider (Germany)
  • Dimensions (L. x W. x H.) 1542 mm x 2100 mm x 1100 mm
  • Power supply: 0,75 kW

Firma Kocuła
ul. Wiśniowa 5
Mokronos Dolny
55-080 Kąty Wrocławskie

tel.: +48  71 363 50 15



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