Wafer cutting device

Cutting wafer sheets according to the size demanded by the client. The cutting unit can be wire or a knife.

• Material: frame made out of stainless steel
• Cover: made out of stainless steel X5CrNi18-10
• Motor: SEW (Germany)
• Programming: Simens (Germany)
• Switch: Schneider (Germany)
• Dimensions (L. x W. x H.) 1542 mm x 2100 mm x 1100 mm
• Power supply: 0,75 kW